- Material:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
2 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
MOQ: 1 |
6,500
In-stock
|
Get Quote | ||
![]() |
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
MOQ: 1 |
6,500
In-stock
|
Get Quote |