- Product Status：
-
- Material：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
MOQ: 1 |
6,500
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 228.6MMX2... |
MOQ: 1 |
6,500
In-stock
|
Get Quote |
